Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. 4、6或8列. 1. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. 3-, 4- and 6-pair designs. These connectors are two-piece devices that connect two printed circuit boards. FEATURES. XCede® HD 1. 1 DOCUMENTS 2. Login or REGISTER Hello, {0}. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. 2. Complementary guide and power modules are also included in the product range. Up to 82 differential pairs. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. 1. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 2. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. One-Piece Interface PCB Array Connectors Memory Card Connectors Custom Products VITA 42 XMC VITA 57. Three levels of sequencing enable hot plugging. Contact Mouser (USA) (800) 346-6873 | Feedback. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Buy XCede HD Series Backplane Connectors. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. 3. DETAILS. § Differential pairs 28-84 per inch (11-33 differential pairs perBuy 923400J40H - Amphenol Communications Solutions - Connector, 4 Col x 4 Diff Pair, XCede HD Series, 1. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Features. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Login or REGISTER Hello, {0}. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82. Motherboard Diagram. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics. Two press-fit sizes, (standard and small) provide board layout options for designers. Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 0” Long. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 1. screw length and part number are dependent on daughtercard thickness (as specified from configurator). developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. performance (up to 28+ Gb/s) in a Hard Metric form factor. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. Contact us today for more details of XCede HD, part number 968-4200-A1H. 11. 32. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1 DOCUMENTS 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. 4. Xcede® HD High Speed Backplane Connectors. The inserts can be installed as per the. 3. Skip to Main Content (800) 346-6873. XCede ® HD and XCede ® HD Plus, this connector provides . 54, 3. Features. BENEFITS. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. Amphenol is one of the leading manufacturers of Backplane connectors. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Integrated power and guidance. Integrated power, guidance, keying and side walls available. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 4, 6 or 8 columns. XCedeHD RAM and XCede HD Inverted RAMrefer to. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede HD achieves the highest performance in an HM compatible form factor. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. The XCede connector delivers the lowest crosstalk of any backplane connector available today. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. 2. 80 mm高密度背板垂直插头. 5 out of 5 stars 3,424. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. com. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. 6. Samtec XCede® HD 3. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or. XCede® connectors also address. Revision SCR No. PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. 96 and 5. EN. We chose the Asus Prime X470-Pro for its inclusion of many modern. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . DETAILS. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Buy XCede HD Plus Series Backplane Connectors. 1. 1. Buy HPTS-3-S-D-VT - Samtec - Connector, Xcede HD Series, 4 Contacts, 3. Search for: Search Home; Categories. Description Initial Date “-“ S1188 Initial Release T. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Send us a Message. 4 differential signal pairs/inch. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. Available in straddle mount, through-hole termination and also SMT. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. XCede 85 Ohm for applications where matching lower system impedance is desired and XCede cable. 2. high speed performance, paddle card edge connector series for next Gen. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. 54, 3. +44 (0)203 301 9900. XCede® connectors also address. Features a simple design, normal or reverse mounting, push-push insert style and a locking technology therefore preventing the card from falling out. 08mm. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 85. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). Mouser offers inventory, pricing, & datasheets for XCede Connectors. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. XCede® connectors also address Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. EachAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 DOCUMENTS 2. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingBuy XCede HD2 Series Backplane Connectors. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. 99. $ 129. 7mil Drill Minimum Pad Size vs. Contact us today for more details of XCede HD, part number 968-4200-A1H. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. XCede HD PLUS & XCede HD2 press-fit connector platform is designed with partial modular reparability. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in mind. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. Login or REGISTER Hello, {0}. 6. DDR SDRAM - Evolution of High-Performance Volatile Memory. 00 mm contact wipe on signal pins. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 54mm pitch down to 0. See Appendix “A” for the seating press recommendations and process recommendations. Features. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. 1 DOCUMENTS 2. For optimal connector configuration, connectors are grouped into signal modules of 4,. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. Skip to Main Content (800) 346-6873. . XCede® connectors also address. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. High-density backplane system – up to 84 differential pairs per linear inch. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. 2. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. TARGET MARKETS. 2. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 2. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. Revision “F” Specification Revision Status . The connectors are intermatable, electrically and mechanically interchangeable. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. Offering a linear density of up to 84 differential pairs per inch (33. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. - FCI. Search for: Search Home; Categories. XCede® connectors also address. Choice of 2 or 4 power banks. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. DETAILS. Mechanical longevity and ruggedness. DETAILS. 1. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. Login or REGISTER Hello, {0}. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede® connectors also address. 4. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Contact Mouser (USA) (800) 346-6873 | Feedback. Vertical or Right Angle. These connectors are two-piece devices that connect two printed circuit boards. Description Initial Date “-“ S1188 Initial Release T. 2. Wang 6/19/19. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3、4和6对设计. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. XCede ® HD and XCede ® HD Plus, this connector provides . Available in industry-standard 2. Description. Three levels of sequencing enable hot plugging. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. XCede® connectors also address. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 9 signal pairs per inch are. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 3. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Offering a linear density of up to 84 differential pairs per inch and can. DETAILS. Formed in 2020 by a merger of three well-established organisations — TechStream, Xcede and Etonwood — our mission is to attract the talent that is helping our clients shape the new global economyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Skip to content. See section 4 regarding XHD2 RAM connectors. 7. 7. 特色. 54 - 5. Spacone 5-29-12 XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 信号端子上可实现高达3. Login or REGISTER Hello, {0}. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. Integrated guidance, keying and polarizing side walls available. See Figure 15 for details. XCede® connectors also address requirements for high linear signal density at the backplane. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. These modules consist of a 12. These connectors are available in 3-, 4- and 6-Pair configurations. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. See section 4 regarding XHD2 RAM connectors. Standard or high-speed wafers available. 80 mm column pitch. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. Back. XCede® connectors also address. Female pin. 5 - Effective capacity assumes average 4:1 data reduction. for connector repairability. . 7mil Drill Minimum Pad Size vs. Mouser offers inventory, pricing, & datasheets for XCede Connectors. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . A full range of flash memory connectors are offered by Amphenol, including SD, Mini-SD, Micro-SD, xD, CF1 & 2. 2. 85 Ω and 100 Ω options. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high XCede HD2 backplane interconnect system. 4-, 5-, 6-, 8-pair configurations. Contact Mouser (Bangalore) 080 42650011 | Feedback. 80 mm High-Density Backplane Right-Angle Receptacle. XCede Connectors are available at Mouser Electronics. 1. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. They are available in 1. 2. 4, 6 or 8 columns. . XCede® connectors also address. Features. 0 REFERENCEDOCUMENTS 2. Amphenol is one of the leading manufacturers of Connectors. 2. Skip to Main Content. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Board-to-board connector / rectangular / SMT. $19. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). REFER TO TB-2150 FOR XCede PRODUCT SPECIFICATIONS. 2. XCede® connectors also address. 54 - 5. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Login or REGISTER Hello, {0}. Contact Mouser (USA) (800) 346-6873 | Feedback. MTP to 4x LC breakout cable is composed of an 8-fiber MTP connector for 40G QSFP+ at one end and 4 duplex LC connectors for 10G SFP+ at the other end. 2 mm, Receptacle, Press Fit, 2 Rows. Connector, XCede HD Series, 100 Contacts, 1. by Xcede. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. This connector is a single-row, 40-pin, right-angle male header strip that can be cut or broken into smaller strips and is great for low-profile connections. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. 3. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Rugged Edge Rate® contact system. Resource The top level of the. This card can be used in an ITX system with an M. XCede High Speed/Modular Connectors are available at Mouser Electronics. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Welcome to Wille Dodge, a family-owned dealership with 44 years of. 0 REFERENCE 2. 3. These point loads may be caused by other beams, user input loads, or columns carried by the beam. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 5-inch backplane 1. 2. 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). And each fiber cable transmits at 10Gbps. XCede® connector family. 1. 10% coupon applied at checkout Save 10% Details. EN. 2-, 3-, 4-, 5-, 6-Pair configurations. Login or REGISTER Hello, {0}. Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. asm jx410-51594_bp. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Contact us today for more details of XCede HD, part number 968-4200-A1H. 1. Advanced Search. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. XCede® connectors also. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 85 Ω and 100 Ω options. 3. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. 2. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. Dislaime Please note that the above information is subect to change without notice. TARGET MARKETS. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. In this category | In this category, (Amphenol) Memory card connector / PCI CCM01 MK5 Series. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. Change Location. 2. Search. As the name suggests, SDRAM is synchronous and relies on the clock for signals, thus. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. This connector ships without wires, terminals and seals. Mouser offers inventory, pricing, & datasheets for XCede Connectors. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Find Parts. refer to c-922-4x0a-500 for signal connector detail. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. Nov 13, 2019. Electrical & Mechanical Models. FEATURES. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. XCede® Stacker. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Basics is present with its full range of products to meet the needs of our customers. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2-, 3-, 4-, 5-, 6-Pair configurations. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Amphenol Communications Solutions. Amphenol is one of the leading manufacturers of Backplane connectors. 2. Skip to Main Content +49 (0)89 520 462 110. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. Scalable upgrades to 56Gb/s without costly redesigns. Contact Mouser (USA) (800) 346-6873 | Feedback. 1 FMC VITA 57.